CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging (Department of Commerce) Submitted by benton on Thu, 11/21/2024 - 06:40
New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina (Department of Commerce) Submitted by benton on Tue, 11/19/2024 - 06:29
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconduct (Department of Commerce) Submitted by benton on Fri, 11/15/2024 - 06:35
Commerce Department and DOE Sign Memorandum of Understanding to Advance Safe, Secure, and Trustworthy Development and Use of AI (Department of Commerce) Submitted by benton on Fri, 11/01/2024 - 06:35
Secretary Raimondo Appoints Eleven Prominent Leaders to the FirstNet Authority Board (Department of Commerce) Submitted by zwalker@benton.org on Wed, 10/30/2024 - 17:15
Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging (Department of Commerce) Submitted by benton on Fri, 10/18/2024 - 14:51
Support Development of Semiconductor Technology Important for Communications and National Security (Department of Commerce) Submitted by benton on Thu, 10/17/2024 - 09:51
Secretary Raimondo Statement on Swiss-U.S. Data Privacy Framework (Department of Commerce) Submitted by zwalker@benton.org on Mon, 09/16/2024 - 16:20
U.S. Department of Commerce Appoints 4 New Members to National AI Advisory Committee (Department of Commerce) Submitted by zwalker@benton.org on Fri, 09/06/2024 - 14:57
Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Sem (Department of Commerce) Submitted by benton on Tue, 08/27/2024 - 05:22