Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging (Department of Commerce) | Benton Institute for Broadband & Society

Submitted by benton on Fri, 10/18/2024 - 14:51

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Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging

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Department of Commerce

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Daily Digest

Daily Digest 10/18/2024

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